3DChiplet Side By Side 3D Magic with 3D Trenching
3DChiplet Side By Side 3D Magic with 3D Trenching 2021-2023 https://science.n-helix.com/2023/07/3dchiplet.html
3D Fabric 5800X3D is hard in production but the delivery is the problem so ... i have another proposal,
Called
Side By Side 3D Magic (c)Rupert S
Yes 3D Chips are good for cache, Simply connecting chiplets does not require 3D or 3D Stacking,
Side By Side 3D Magic (c)Rupert S
Has Layered Chip wafer & PCB Board with interweaved wires:
Carbon fibers, Copper or aluminum or Iron, Not a problem
Through the PCB Chip board, These micro tunnels provide all the PCI & Chip tunnels that a Board could require!
Layered micro tunnel imprinted PCB can have 3 wires per layer (crosswise, Diagonal & Ordered form)
Additionally tunneling up and down is not a problem for you simply layer a connection point that is welded to the next layer as it is laid on top..
Micro film is available, As this is both electrostatic & noise resistant composite.
Since this is a micro multiformat PCB / Chip fabric, At no time do you have to worry about dampness or heat split when made well.
https://www.youtube.com/watch?v=pBZQeW1eeEw
Example of 3D Layered PCB, A but too rigid but good for a phone or telescope Board..
Chips can be placed inside if you need to! for space reasons; Embed the chiplet..
PCB is ideal for this task; Common view PCB is large space & coy compact?
3D PCB is a space saver & 3D Network Ethernet/Chip IO memory ops
PCB Wire mesh (internal networks) = - |, PCB Layer = _
___(CHIP With Connect)______
----|-----|-----|----|----|-------
_____|____|__________
------(cooling & IO Chip)---------
______||___||___________
07:39 23/07/2023 (c)Rupert S
Circuit 3D Print with laser (c)RS
While trenching semiconductors work, in space (vacuum) electrical energy transfers through vacuum!
So you have to use a resistor material in the trench, this is not impossible if you imbed ceramic formulas with a laser!
you can however with this technology go upto 2.7v on 5nm; Because higher voltages are faster & more resistant; this makes sense..
The trench (hole) Formatic processor 3D layering technology with:
Circuit = C, Trench = _/ , resistor = r, Circuit in trench = c, raised bit Circuit or resistor = /C\
C\r/C C\r/C C\r/C
C_/C C_/C C_/C
C_/C C\r/C C_/C
/C\c/C\r/C\r/C\r/C\
The challenge of using traditional circuit printing methods in space is that the vacuum can cause the circuit to degrade over time..
This is because the vacuum can strip away the electrons that carry current in the circuit.
3D laser circuit printing could help to mitigate this problem by creating a very dense and compact circuit. This reduces the surface area of the circuit that is exposed to the vacuum and it helps to protect the circuit from the harsh environment of space.
& Also..
One of the challenges of using trench & processor circuit methods in space is that electrical energy transfers through vacuum; Which can be difficult in a vacuum.
This means that you need to use a resistor material in the trench,
It is possible to imbed ceramic formulas with a laser; This could be a promising way to create resistors in/for space.
However, 3D laser circuit printing could help to mitigate this problem; As the laser can be used to create a very precise and durable circuit.
This technology is meant for the world but also with spatial integrity for deep space & So functionally Rugged/Rigid in use & Function.
Additional thoughts on the challenges and potential of 3D laser circuit printing for space applications:
Challenges:
The vacuum of space can be very harsh on materials, so it is important to use materials that are resistant to radiation and temperature extremes.
Potential:
3D laser circuit printing could allow for the creation of more complex and efficient circuits.
3D laser circuit printing could make it possible to print circuits on-demand; Which could be a major advantage for space missions.
It could also be used to create circuits that are more resistant to the harsh environment of space.
The lack of gravity can also make it difficult to print precise circuits..
(c)Rupert S
Application 23/07/2023
https://science.n-helix.com/2023/07/3dchiplet.html
https://science.n-helix.com/2023/06/map.html
https://science.n-helix.com/2023/06/ptp.html
Anonymous
shared this idea